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NTMFS4121N
Power MOSFET
30 V, 29 A, Single N ? Channel,
SO ? 8 Flat Lead
Features
? Low R DS(on)
? Optimized Gate Charge
? Low Inductance SO ? 8 Package
? These are Pb ? Free Devices
Applications
? Notebooks, Graphics Cards
? DC ? DC Converters
? Synchronous Rectification
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Typ
4.0 m W @ 10 V
5.5 m W @ 4.5 V
D
I D Max
(Note 1)
29 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
20
V
V
G
T A = 85 ° C
T A = 25 ° C
T A = 85 ° C
S AYWZZ
Continuous Drain Current Steady T A = 25 ° C
(Note 1 ) State
t v 10 s T A = 25 ° C
Power Dissipation (Note 1) Steady
State
t v 10 s
Continuous Drain Current T A = 25 ° C
(Note 2) Steady
State
Power Dissipation (Note 2) T A = 25 ° C
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(V DD = 30 V, V GS = 10 V, I PK = 29 A,
L = 1 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I D
P D
I D
P D
I DM
T J , T stg
I S
E AS
T L
17
12
29
2.2
6.6
11
8.0
0.9
88
? 55 to
150
6.5
430
260
A
W
A
W
A
° C
A
mJ
° C
S
MARKING
DIAGRAM
D
S
1 S 4121N
SO ? 8 FLAT LEAD
CASE 488AA G
STYLE 1 D
4121N = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
D
D
THERMAL RESISTANCE MAXIMUM RATINGS
Device
Package
Shipping ?
Parameter
Junction ? to ? Case ? Steady State
Symbol
R q JC
Value
2.2
Unit
° C/W
NTMFS4121NT1G
SO ? 8 FL
(Pb ? Free)
1500 Tape & Reel
Junction ? to ? Ambient ? Steady State (Note 1) R q JA 56.2 ° C/W
Junction ? to ? Ambient ? t v 10 s (Note 1) R q JA 19
Junction ? to ? Ambient ? Steady State (Note 2) R q JA 141.1
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 1.0 in sq).
NTMFS4121NT3G SO ? 8 FL 5000 Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
May, 2012 ? Rev. 4
1
Publication Order Number:
NTMFS4121N/D
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